Подробная информация о событии

  • Date:
  • Место: CTec Girona
  • Language: Английский
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The innovative laser die cutting system gives to the market an additional benefit of making life easier for the packaging end users with solutions as microperforation, alphanumeric codes, windows and easy open.
This 3-day course will review in dept these procedures and the optimization of the slitting machine for an efficient production.

Key benefits:

  • To Know in dept the laser die-cutting solutions and its procedures
  • Optimization of the slitting process
  • Efficiency in production of laser die-cutting
  • Reduction of the defects controlling the variables and improving quality control
  • Share professional experiences and interaction with other responsible for the process.

Addressed to: Slitting operators and production managers.